A study on the influence of void and moisture contents of some building materials on their thermal transport properties and implications on thermal performance of building envelops

dc.contributor.advisorKrishnamoorthy, S
dc.contributor.authorBhattacharjee, B.
dc.date.accessioned2013-11-21
dc.date.accessioned2024-10-29T10:59:25Z
dc.date.issued1989
dc.identifier.urihttp://10.17.50.146:4000/handle/123456789/2659
dc.relation.ispartofseriesTH1724
dc.subjectThermal performance of building
dc.titleA study on the influence of void and moisture contents of some building materials on their thermal transport properties and implications on thermal performance of building envelops
dc.typeThesis

Files

Original bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
TH-1724_ABSTRACT.pdf
Size:
522.25 KB
Format:
Adobe Portable Document Format